
| Type | Description |
|---|---|
| Series: | D01-950 |
| Package: | Bulk |
| Part Status: | Obsolete |
| Type: | SIP |
| Number of Positions or Pins (Grid): | 8 (1 x 8) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Quantity | Unit Price | Ext. Price |
|---|
Current price of D01-9500842 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@Vigorcomp.com
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 32POS GOLD
CONN IC DIP SOCKET 48POS TIN
6P,2MM,BRK HDR,SRRT,2.8,0.38AU,T
MEMS OSC XO 12.0000MHZ CMOS SMD
CONN SOCKET SIP 8POS GOLD
CABLE ASSY U.FL PLUG SMT