XC2299H200F100LABKXUMA1 vs XC2797X200F100LABKXUMA1

This detailed comparison of XC2299H200F100LABKXUMA1 and XC2797X200F100LABKXUMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC2299H200F100LABKXUMA1

IR (Infineon Technologies)

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XC2797X200F100LABKXUMA1

IR (Infineon Technologies)

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Specifications Hide identical items

Manufacturer	IR (Infineon Technologies)	IR (Infineon Technologies)
Package / Case	176-LQFP Exposed Pad	176-LQFP Exposed Pad
Description	IC MCU 16/32B 1.6MB FLSH 176LQFP	IC MCU 16/32B 1.6MB FLSH 176LQFP
In Stock	160	209
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Not For New Designs
Series	XC22xxH	XC27x7X
Package	Tape & Reel (TR)	Tape & Reel (TR)
Core Processor	C166SV2	C166SV2
Core Size	16/32-Bit	16/32-Bit
Speed	100MHz	100MHz
Connectivity	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals	DMA, I²S, POR, PWM, WDT	I²S, POR, PWM, WDT
Number of I/O	150	150
Program Memory Size	1.6MB (1.6M x 8)	1.6MB (1.6M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	138K x 8	138K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 30x10b	A/D 30x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	PG-LQFP-176-12	PG-LQFP-176-12