ATSAM3N0CA-CU vs ATSAM3N0CA-CUR

This detailed comparison of ATSAM3N0CA-CU and ATSAM3N0CA-CUR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

ATSAM3N0CA-CU

Roving Networks / Microchip Technology

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ATSAM3N0CA-CUR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	100-TFBGA	100-TFBGA
Description	IC MCU 32BIT 32KB FLASH 100TFBGA	IC MCU 32BIT 32KB FLASH 100TFBGA
In Stock	762	2 417
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	SAM3N	SAM3N
Package	Tray	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3
Core Size	32-Bit	32-Bit
Speed	48MHz	48MHz
Connectivity	I²C, IrDA, SPI, UART/USART	I²C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O	79	79
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Data Converters	A/D 16x10b; D/A 1x10b	A/D 16x10b; D/A 1x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	100-TFBGA (9x9)	100-TFBGA (9x9)