Infineon Expands AURIX™ TC3x Automotive MCUs with New 400 MHz Variants
The 2nm Era Begins: Global Chipmakers Race for Next-Generation Process Technology
Japan to Establish Three AI Chip R&D Centers, Aiming for Domestic Prototype Manufacturing by 2028
Infineon and BMW Accelerate SDV Adoption, Boosting Automotive Semiconductor Content
SK hynix Unveils 14.4Gbps LPDDR6 as Samsung Accelerates Development
EPC and Renesas Partner to Accelerate Low-Voltage GaN Expansion
TSMC Upgrades Japan Fab to 3 nm, Investment Soars to $17 Billion
India Accelerates Its Semiconductor Ambitions
TE Connectivity Reports Q1 FY2026 Results
Infineon Introduces Industry's First Wi-Fi 7 IoT 20 MHz Triple-Band Wireless Solution
Infineon's CoolMOS™ 8 Sets New Benchmark in Power System Optimization
Onsemi Introduces New Cooling Packaging Technology to Boost Efficiency in Power-Hungry Applications
STMicroelectronics Secures €1 Billion Financing to Strengthen Europe’s Semiconductor Autonomy
TSMC Capacity Constraints Prompt Industry Leaders to Rethink Supply Chain